JPH0457794B2 - - Google Patents

Info

Publication number
JPH0457794B2
JPH0457794B2 JP63313832A JP31383288A JPH0457794B2 JP H0457794 B2 JPH0457794 B2 JP H0457794B2 JP 63313832 A JP63313832 A JP 63313832A JP 31383288 A JP31383288 A JP 31383288A JP H0457794 B2 JPH0457794 B2 JP H0457794B2
Authority
JP
Japan
Prior art keywords
resin
paper
base paper
laminate
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63313832A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02160998A (ja
Inventor
Kazutaka Nakagawa
Yasutoku Nanri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Kokusaku Pulp Co Ltd
Original Assignee
Sanyo Kokusaku Pulp Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Kokusaku Pulp Co Ltd filed Critical Sanyo Kokusaku Pulp Co Ltd
Priority to JP31383288A priority Critical patent/JPH02160998A/ja
Publication of JPH02160998A publication Critical patent/JPH02160998A/ja
Publication of JPH0457794B2 publication Critical patent/JPH0457794B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Paper (AREA)
  • Organic Insulating Materials (AREA)
  • Laminated Bodies (AREA)
JP31383288A 1988-12-14 1988-12-14 電気絶縁積層板用原紙 Granted JPH02160998A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31383288A JPH02160998A (ja) 1988-12-14 1988-12-14 電気絶縁積層板用原紙

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31383288A JPH02160998A (ja) 1988-12-14 1988-12-14 電気絶縁積層板用原紙

Publications (2)

Publication Number Publication Date
JPH02160998A JPH02160998A (ja) 1990-06-20
JPH0457794B2 true JPH0457794B2 (en]) 1992-09-14

Family

ID=18046047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31383288A Granted JPH02160998A (ja) 1988-12-14 1988-12-14 電気絶縁積層板用原紙

Country Status (1)

Country Link
JP (1) JPH02160998A (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04239533A (ja) * 1991-01-22 1992-08-27 Honshu Paper Co Ltd 無機質繊維基材プリプレグシートの製造法および絶縁性積層体の製造法
JP3862770B2 (ja) * 1995-09-07 2006-12-27 日立化成工業株式会社 金属張積層板の製造方法
JP5644864B2 (ja) * 2010-12-27 2014-12-24 王子ホールディングス株式会社 微細繊維状セルロースコンポジットプリプレグシートの製造方法、微細繊維状セルロースコンポジットシートの製造方法及び微細繊維状セルロースコンポジット積層シートの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52119672A (en) * 1976-04-01 1977-10-07 Honshu Paper Co Ltd Manufacture of laminated plate and copperrclad laminated plate
JPS54147210A (en) * 1978-05-08 1979-11-17 Fuji Kakou Seishi Kk Phenolic resin containing paper and production
JPS54160479A (en) * 1978-06-08 1979-12-19 Mitsui Toatsu Chem Inc Manufacture of wood fibreboard
JPS58156100A (ja) * 1982-03-09 1983-09-16 日東紡績株式会社 高強度難燃性断熱ボ−ドの製造方法
JPS59112099A (ja) * 1982-12-15 1984-06-28 日本無機株式会社 ガラス紙の製造法
JPS61296199A (ja) * 1985-06-20 1986-12-26 山陽国策パルプ株式会社 電気絶縁積層板用原紙
JPS63211400A (ja) * 1987-02-24 1988-09-02 松下電工株式会社 積層板用紙基材

Also Published As

Publication number Publication date
JPH02160998A (ja) 1990-06-20

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